CEVA · NASDAQ
Technology · Semiconductors
$32.15
-0.68%
Close on Oct 29, 2026
Research data through 2026-10-28
Long-term research evidence only. No price targets, no trading signals, no recommendations.
Free research · no account required
Research data through Oct 28, 2026. Research is updated periodically, not in real time.
51
of 100 · stored research reading
Stored Quality research reads 51 of 100, a middle-of-the-universe reading. The measurements behind it are mixed.
Quality research measures durability of the business itself from stored fundamentals: balance-sheet strength, profitability consistency and cash generation. It is a research reading, not a prediction of future returns.
How this is measured59
of 100 · stored research reading
Stored Fundamental Momentum research reads 59 of 100. Stored measurements classify recent reported fundamentals as middle. This describes reported financial change already disclosed, with no forward-looking claim.
Fundamental Momentum research measures the direction of recently reported company fundamentals compared with the company's own history. It describes reported change, not future price movement.
How this is measured9
of 100 · stored research reading
Stored Capital Returns research reads 9 of 100, recorded as weak. No dividend is recorded for this company, so the reading rests on buybacks and dilution control. Share count has increased at about 3.9% a year in the stored window.
Capital Returns research measures how a company has actually returned cash to shareholders: dividend record, buyback effectiveness, dilution control and how those payments were funded.
How this is measuredNot currently available. No stored valuation ratios exist for this company.
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Research Collections
This company does not currently satisfy any collection rule. That is a stored research result, not a judgement about the business.
Browse collectionsPlain-English definitions, with the formula and the limitations of each measure.
In the company’s own words
We are the leader in silicon and software intellectual property ("IP") enabling Physical AI - the intelligence embedded directly into billions of devices that connect, sense, and infer data in the real world. Physical AI represents the natural evolution of Edge AI. While traditional Edge AI focuses on local inference on devices, Physical AI unifies connectivity, sensing, and inference into a cohesive technology fabric. This integrated approach allows devices not only to process information at the edge but also to understand their physical surroundings, communicate seamlessly, and interact intelligently with both the environment and the cloud. As Physical AI adoption accelerates across markets, these foundational layers are becoming essential for next generation consumer, automotive, industrial, and mobile systems.
We are the only IP company with established leadership and deep expertise across all three foundational layers of Physical AI – connect, sense and infer. Our comprehensive portfolio powers the connectivity, perception, and intelligence capabilities of many of today’s most advanced smart edge products across the consumer IoT, automotive, industrial and infrastructure, and mobile and PC markets. Devices incorporating Ceva IP have shipped in more than 20 billion units since 2003, and today our technologies are embedded in approximately 2 billion devices annually, reflecting the ubiquity and long term durability of our IP across multiple generations of silicon and end market product cycles.
Our business model centers on licensing our IP platforms, processors, software, and related technologies to semiconductor and original equipment manufacturer ("OEM") customers. These customers integrate our technologies into their application specific integrated circuits ("ASICs"), application specific standard products ("ASSPs"), and systems on chip ("SoCs"), which they manufacture, market, and sell globally. By providing pre validated, production proven IP and comprehensive software stacks, we enable our customers to reduce development time, improve performance and power efficiency, streamline certification and compliance, and bring differentiated products to market more reliably and cost effectively.
We operate with a global development footprint of more than 400 R&D, support, and sales professionals, reflecting the multidisciplinary expertise required to support wireless communications, advanced AI DSP architectures, AI inference engines, sensor fusion algorithms, and embedded software. Our headquarters is located in Rockville, Maryland, and we maintain development centers in France, Greece, Ireland, Israel, Serbia, and the United States. This globally distributed engineering model allows us to attract specialized talent, collaborate closely with customers in key regions, and support complex, multi site development programs.
Quoted from the business section of this company’s 10-K filed February 27, 2026. Read the filing
General research only. Not personalized advice. Public filings may be delayed, amended, incomplete, or reflect positions that have changed since the reporting date.
